Copper deposition baths: Advanced analytical solutions for development and monitoring
60 min
en
// Metal products, plating & finishing
Dr. Julia van Drunen, Head of Competence Center Voltammetry, and Dr. Christian Haider, Head of Competence Center Titration at Metrohm International Headquarters, are joined by Jeroen Zaalberg, Head of Product Management at Metrohm Applikon. They present the advantages of a multi‑method analytical approach to develop and monitor copper deposition baths.
Titration, Cyclic Voltammetric Stripping, pH measurement, and X-ray fluorescence for a complete picture
By combining titration and cyclic voltammetric stripping (CVS) with complementary techniques such as pH measurement and X‑ray fluorescence (XRF), users gain a complete picture of their plating bath chemistry. Each method addresses specific components, from metallic ions and salts to organic additives and metallic contaminants.
Key learnings of the webinar:
- How titration and CVS can be combined with XRF and pH measurement for a more complete assessment of copper plating baths
- The benefits of automation beyond throughput, including improved repeatability and reduced operator variability
- Why our analytical technologies are perfectly suited for the various players in this industry, from bath chemistry development to the production floor
