Metal products, plating, and finishing

Zinc coatings are widely applied for medical devices and to protect steel against corrosion. Electrodeposition, modulated by electrochemical parameters and tailored additives such as polyethylene glycol (PEG), enables control over coating morphology, with PEG shown to delay deposition and promote smoother surfaces. This Application Note demonstrates that EQCM-D, integrated with electrochemical methods, provides detailed insight into Zn deposition and additive effects, supporting process optimization for coating performance.

Rare earth elements (REEs) are critical materials whose deposit viability and processing streams require accurate mass-fraction determination during ore dissolution and purification. This Application Note describes a rapid potentiometric back-titration using a copper ion-selective electrode (Cu-ISE) that enables selective quantification and partial separation of REEs in complex matrices with near-quantitative recovery. As an absolute, flexible, and cost-effective method with ICP-compatible sample preparation, back-titration is well suited both as a reference technique and for rapid on-site analysis.

Purity of rare earth elements (REEs) can be determined by absolute complexometric titration with xylenol orange (ISO 23597). This approach achieves around 100% recovery, eliminates the need for calibration, and offers higher accuracy and reproducibility than techniques such as AAS (atomic absorption spectroscopy). Photometric titration with the Optrode M2 offers adjustable wavelength detection, providing a fast, precise, and cost-effective alternative to other conventional methods.

brightRC enables reliable CVS (or CPVS) brightener quantification without repeated standard additions, especially for additive systems with nonlinear signal behavior. By using external response curve (RC) calibration and flexible regression, it avoids systematic errors inherent to linear standard addition methods and significantly reduces analysis time. This makes brightRC ideal for high throughput routine control in stable copper plating baths.

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